A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via-Reference-Cited by-同舟云学术

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A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Pan Ke¹,Okoro Chukwudi²,Lai Yangyang¹,Joshi Dhananjay³,Park Seungbae¹,Pollard Scott⁴

Affiliation:

1. Binghamton University,Mechanical Engineering Department,Binghamton,USA

2. Corning Research and Development Corporation,Mechanics and Reliability Sciences (MaRS),Corning,USA

3. Manufacturing Technology and Engineering Corning Incorporated,Corning,USA

4. Corning Research and Development Corporation,Integration Technologies Department,Corning,USA

Funder

Research and Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816541.pdf?arnumber=9816541

Reference30 articles.

1. Investigation of underfilling BGAs packages – Thermal fatigue

2. The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

3. The interfacial reliability of through-glass vias for 2.5D integrated circuits

4. Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates

5. In-situ temperature-dependent characterization of copper through glass via (TGV)

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3. Modeling and Characterization of Annealing Effect on the Cu Protrusion and Thermomechanically Behaviors of Through Glass Via;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

4. Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5D Heterogeneous Packages;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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