Author:
Pan Ke,Xu Jiefeng,Lai Yangyang,Park Seungbae,Okoro Chukwudi,Joshi Dhananjay,Pollard Scott
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging;Lee;J. Micromech. Microeng.,2013
2. Product level design optimization for 2.5D package pad cratering reliability during drop impact;Wang;Proc. Electron. Components Technol. Conf.,2019
3. The effect of solder paste volume on surface mount assembly self-alignment;Pan;Procedia Manuf.,2019
4. Development of through glass via technology for 3D packaging;Takahashi,2013
5. The interfacial reliability of through-glass vias for 2.5D integrated circuits;Ahmed;Microelectron. Int.,2020
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