The effect of solder paste volume on surface mount assembly self-alignment

Author:

Pan K.,Ha J.H.,Wang H.Y.,Veeraraghavan V.,Park S.B.

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Reference13 articles.

1. “Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering,”;Najib;Microelectron. Reliab.,2017

2. “Modelling the self-alignment of passive chip components during reflow soldering,”;Krammer;Microelectron. Reliab.,2014

3. “Self-alignment of microchips using surface tension and solid edge,”;Tsai;Sensors Actuators, A Phys.,2007

4. “Self-alignment of microparts using liquid surface tension - Behavior of micropart and alignment characteristics,”;Sato;Precis. Eng.,2003

5. “Self-alignment for microparts assembly using water surface tension,”;Sato;Device Process Technol. MEMS Microelectron.,2003

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