Self-alignment of microchips using surface tension and solid edge-Reference-Cited by-同舟云学术

Self-alignment of microchips using surface tension and solid edge

Published:2007-09 Issue:1-2 Volume:139 Page:343-349
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Tsai C. Gary,Hsieh C. Max,Yeh J. Andrew

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference13 articles.

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4. Microassembly of hybrid magnetic MEMS;Vikramaditya;J. Micromech.,2001

5. Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates;Yeh;IEEE Photonics Technol. Lett.,1994

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