The effect of solder paste volume on solder joint shape and self-alignment of passive components-Reference-Cited by-同舟云学术

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The effect of solder paste volume on solder joint shape and self-alignment of passive components

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Pan Ke,Ha Jong Hwan,Pham Van Lai,Wang Huayan,Xu Jiefeng,Park S.B.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159467.pdf?arnumber=9159467

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of hot air gun soldering process parameters on the electromechanical properties of electronic yarn;The Journal of The Textile Institute;2024-05-29

2. A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology;The International Journal of Advanced Manufacturing Technology;2024-05-20

3. PADS: Predictive Anomaly Detection for SMT Solder Joints Using Novel Features From SPI and Pre-AOI Data;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

4. A Pick-and-Place Process Control Based On the Bootstrapping Method for Quality Enhancement in Surface Mount Technology;2023-10-31

5. Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

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