Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages
Author:
Affiliation:
1. Mechanical Engineering Department, Binghamton University, Binghamton, NY, USA
2. Microsoft Corporation, Redmond, WA, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/10287668/10220109.pdf?arnumber=10220109
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3. Surface evolver manual, version 2.26;brakke,2005
4. Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages
5. High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height
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