Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging-Reference-Cited by-同舟云学术

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Fan Jiajie¹,Qian Yichen²,Chen Wei¹,Jiang Jing¹,Tang Zhuorui¹,Fan Xuejun³,Zhang Guoqi⁴

Affiliation:

1. Fudan University,Institute of Future Lighting, Academy for Engineering & Technology,Shanghai,China

2. Hohai University,College of Mechanical and Electrical Engineering,Changzhou,China

3. Lamar University,Department of Mechanical Engineering,Beaumont,TX,USA

4. Delft University of Technology,EEMCS Faculty,Delft,The Netherlands

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

Reference12 articles.

1. Electric-thermal-stress Oriented Multi-objective Optimal Design of Power Module Package;zeng;Proceedings of the CSEE,2019

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4. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023