Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms

Published:2024-05-28 Issue: Volume: Page:2143-2149
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Yan Xuyang¹,Chen Wei¹,Li Wenyu¹,Jiang Jing¹,Fan Xuejun²,Zhang Guoqi³,Fan Jiajie¹

Affiliation:

1. Fudan University,Academy for Engineering & Technology; Shanghai Engineering Technology Research Center of SiC Power Device,Shanghai,China

2. Lamar University,Department of Mechanical Engineering,Beaumont,USA

3. Delft University of Technology,EEMCS Faculty,Delft,the Netherlands

Funder

National Natural Science Foundation of China

Technology Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565151.pdf?arnumber=10565151

Reference8 articles.

1. Reliability-Oriented Automated Design of Double-Sided Cooling Power Module: A Thermo-Mechanical-Coordinated and Multi-Objective-Oriented Optimization Methodology

2. Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

3. Structure Optimization and Reliability Investigation on Copper Pillar Interconnections for Double-sided Cooling Power Module

4. Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

5. Improved transmission line model for high-frequency modelling of through silicon vias

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP