Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm-Reference-Cited by-同舟云学术

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Chen Wei¹,Yan Xuyang¹,Ibrahim Mesfin S.²,Meda Abdulmelik H.³,Fan Xuejun⁴,Zhang Guoqi⁵,Fan Jiajie¹

Affiliation:

1. Institute of Future Lighting, Academy for Engineering & Technology; Shanghai Engineering Technology Research Center of SiC Power Device, Fudan University,Shanghai,China,200433

2. Centre for Advances in Reliability and Safety,New Territories,Hong Kong,999077

3. The Hong Kong Polytechnic University,Hung Hom,Hong Kong

4. Lamar University,Department of Mechanical Engineering,Beaumont,TX,USA,77710

5. Delft University of Technology,EEMCS Faculty,Delft,The Netherlands,2628CD

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195727.pdf?arnumber=10195727

Reference16 articles.

1. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

2. Research on Diode Product Reliability of FOPLP Based on PCB Process

3. Comparison of Darveaux model and Coffin-Manson model for fatigue life prediction of BGA solder joints

4. Finite Element Analysis and Fatigue Life Prediction of BGA Mixed Solder Joints

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1. Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28