Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms-Reference-Cited by-同舟云学术

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

Published:2013-02-23 Issue:6 Volume:42 Page:963-972
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hokka Jussi,Mattila Toni T.,Xu Hongbo,Paulasto-Kröckel Mervi

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-013-2475-5.pdf

Reference23 articles.

1. S. Nurmi, J. Sundelin, E. Ristolainen, and T. Lepistö, Microelectron. Reliab. 44, 485 (2004).

2. J.W. Morris Jr, D. Tribula, T.S.E. Summers, and D. Grivas, Solder Joint Reliability, ed. J.H. Lau (New York: Van Nostrand Reinold, 1991), pp. 225–265

3. J.W. Morris Jr, D. Grivas, D. Tribula, T. Summers, and D. Frear, Solder. Surf. Mt. Technol. 1, 4 (1989).

4. T.T. Mattila, T. Laurila, and J.K. Kivilahti, Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability and Packaging, ed. E. Suhir, C.P. Wong, and Y.C. Lee (New York: Springer, 2007), pp. 313–350

5. T.T. Mattila and J.K. Kivilahti, IEEE Trans. Compon. Packag. Technol. 33, 629 (2010).

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Evaluation of SAC solder joint thermomechanical fatigue in different types of components;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

5. Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board;Journal of Materials Science: Materials in Electronics;2021-08-16