QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
Author:
Affiliation:
1. Institut de Recherche Technologique Saint-Exupéry,Toulouse,France
2. University of Bordeaux,IMS Laboratory,Talence,France
3. Elemca,Toulouse,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816443.pdf?arnumber=9816443
Reference21 articles.
1. Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling
2. Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys
3. Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling
4. Aging impact on the accelerated thermal cycling performance of lead-free BGA solder joints in various stress conditions
5. Improved predictions of lead free solder joint reliability that include aging effects
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1. Using X-ray imaging for the study of crack development in solder reliability testing;Microelectronics Reliability;2023-11
2. Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
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