Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations-Reference-Cited by-同舟云学术

Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations

Published:2023-04-17 Issue: Volume: Page:
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Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Soestbergen M. van¹,Roucou R.²,Rebosolan M.³,M Zaal J.J.¹

Affiliation:

1. NXP Semiconductors, Package Innovation,Gerstweg 2,Nijmegen,Netherlands,6534 AE

2. NXP Semiconductors, Corporate Quality,Gerstweg 2,Nijmegen,Netherlands,6534 AE

3. Delft University of Technology,dep. of Aerospace Engineering,Kluyverweg 1,Netherlands,2629 HS Delft

Publisher

IEEE

Link

Reference12 articles.

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1. Thermo-Mechanical Compact Model to Simulate Solder Fatigue of QFN packages;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07