Assessment of Thermal-aware Floorplans in a 3D IC for Server Applications
Author:
Affiliation:
1. Samsung Electronics Co., Ltd.,PKG Design Team Test & System Package Dept.,Hwaseong-Si,Republic of Korea
2. Samsung Electronics,PKG Design Team Test & System Package Dept.,Hwaseong-Si,Republic of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816566.pdf?arnumber=9816566
Reference9 articles.
1. A liquid cooling solution for temperature redistribution in 3D IC architectures
2. Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits
3. Steady state thermal characterization and junction temperature estimation of multichip module packages using the response surface method
4. Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits
5. Measurement and Simulation of Stacked Die Thermal Resistances
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Heat transfer enhancement for 3D chip thermal simulation and prediction;Applied Thermal Engineering;2024-01
2. High Thermal Conductivity Insulators for Thermal Management in 3D Integrated Circuits;IEEE Electron Device Letters;2023-03
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