Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference38 articles.
1. Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory);Kim;IEEE Trans. Comput.,2013
2. J.H. Lau, Fan-out wafer-level packaging for 3D IC heterogeneous integration, in: 2018 China Semiconductor Technology International Conference (CSTIC), IEEE, Shanghai, China, 2018, pp. 1-6.
3. F. Inoue, A. Jourdain, J. De Vos, E. Sleeckx, E. Beyne, J. Patel, O. Ansell, H. Ashraf, J. Hopkins, D. Thomas, Characterization of extreme Si thinning process for wafer-to-wafer stacking, in: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), IEEE, Las Vegas, NV, USA, 2016, pp. 2095-2102.
4. C. Hu, M. Chen, W. Chiou, C. Doug, 3D Multi-chip Integration with System on Integrated Chips (SoIC™), in: 2019 Symposium on VLSI Technology, IEEE, Tyoto, Japan, 2019, pp. T20-T21.
5. Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP);Lau;Microelectron. Reliab.,2012
Cited by 35 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation on thermal-hydraulic performance for local hotspot via variable density design of a micro-jet heat sink;International Communications in Heat and Mass Transfer;2024-08
2. Simultaneously performing interlayer copper interconnecting and TSV filling in stacked chips at room temperature based on copper electroplating;AIP Advances;2024-07-01
3. Rapid heat source layout optimization in three‐dimensional integrated circuits using artificial neural network reduced‐order model in combination with Bayesian optimization;Heat Transfer;2024-05-27
4. Optimizing performance for cooling electronic components using innovative heterogeneous materials;Applied Energy;2024-05
5. Trends in sustainable materials for passive thermal management in 5G enabled portable electronics;Applied Nanoscience;2024-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3