Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

Author:

Kim Dae Hyun,Athikulwongse Krit,Healy Michael B.,Hossain Mohammad M.,Jung Moongon,Khorosh Ilya,Kumar Gokul,Lee Young-Joon,Lewis Dean L.,Lin Tzu-Wei,Liu Chang,Panth Shreepad,Pathak Mohit,Ren Minzhen,Shen Guanhao,Song Taigon,Woo Dong Hyuk,Zhao Xin,Kim Joungho,Choi Ho,Loh Gabriel H.,Lee Hsien-Hsin S.,Lim Sung Kyu

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Computational Theory and Mathematics,Hardware and Architecture,Theoretical Computer Science,Software

Cited by 42 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. RISC-Vlim, a RISC-V Framework for Logic-in-Memory Architectures;Electronics;2022-09-21

2. TB-NUCA: A Temperature-Balanced 3D NUCA Based on Bayesian Optimization;Electronics;2022-09-14

3. Introduction to 3D Technologies;3D Interconnect Architectures for Heterogeneous Technologies;2022

4. Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03

5. Development and Realization of Computer Three-dimensional Aided Design System for Industrial Design;Journal of Physics: Conference Series;2021-11-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3