Abstract
Three-dimensional network-on-chip (NoC) is the primary interconnection method for 3D-stacked multicore processors due to their excellent scalability and interconnect flexibility. With the support of 3D NoC, 3D non-uniform cache architecture (NUCA) is commonly used to organize the last-level cache (LLC) due to its high capacity and fast access latency. However, owing to the layered structure that leads to longer heat dissipation paths and variable inter-layer cooling efficiency, 3D NoC experiences a severe thermal problem that has a big impact on the reliability and performance of the chip. In traditional memory-to-LLC mapping in 3D NUCA, the traffic load in each node is inconsistent with its heat dissipation capability, causing thermal hotspots. To solve the above problem, we propose a temperature-balanced NUCA mapping mechanism named TB-NUCA. First, the Bayesian optimization algorithm is used to calculate the probability distribution of cache blocks in each node in order to equalize the node temperature. Secondly, the structure of TB-NUCA is designed. Finally, comparative experiments were conducted under random, transpose-2, and shuffle traffic patterns. The experimental results reveal that, compared with the classical NUCA mapping mechanism (S-NUCA), TB-NUCA can increase the mean-time-to-failure (MTTF) of routers by up to 28.13% while reducing the maximum temperature, average temperature, and standard deviation of temperature by a maximum of 4.92%, 4.48%, and 20.46%, respectively.
Funder
Scientific and Technological Innovation Talents Project
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering
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