A liquid cooling solution for temperature redistribution in 3D IC architectures

Author:

Kearney Daniel,Hilt Thierry,Pham Pascale

Publisher

Elsevier BV

Subject

General Engineering

Reference29 articles.

1. Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux;Kim;Journal of Heat Transfer,2010

2. S. Cheramy, et al., 3D integration process flow for set-top box application: description of technology and electrical results, in: Proceedings of the Microelectronics and Packaging Conference, EMPC, European, 2009, pp. 1–6.

3. International Technology Roadmap for Semiconductors, ITRS2006.

4. A. Bar-Cohen, Thermal management of on-chip hot spots and 3D chip stacks, in: Proceedings of the IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS, 2009, pp. 1–8.

5. Hotspot-limited microprocessors: direct temperature and power distribution measurements;Hamann;IEEE Journal of Solid-State Circuits,2007

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