Design and test of shape memory alloy fins for self-adaptive liquid cooling device-Reference-Cited by-同舟云学术

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Design and test of shape memory alloy fins for self-adaptive liquid cooling device

Published:2022-04 Issue: Volume:206 Page:118010
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Regany Desideri,Majós Francesc,Barrau Jérôme,Rosell Joan,Ibáñez Manuel,Fréchette Luc G.^ORCID,Vilarrubí Montse

Funder

European Regional Development Fund

European Commission

Generalitat de Catalunya

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference45 articles.

1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981

2. Optimal thermal operation of liquid-cooled electronic chips;Sharma;Int. J. Heat Mass Transf.,2012

3. IBM POWER7 multicore server processor;Sinharoy;IBM J. Res. Dev.,2011

4. A liquid cooling solution for temperature redistribution in 3D IC architectures;Kearney;Microelectronics J.,2012

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