Author:
Sharma Chander Shekhar,Zimmermann Severin,Tiwari Manish K.,Michel Bruno,Poulikakos Dimos
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference42 articles.
1. Cramming more components onto integrated circuits;Moore;Electronics,1965
2. High-performance heat sinking for VLSI;Tuckerman;Electr. Dev. Lett. IEEE,1981
3. Manifold microchannel heat sinks: isothermal analysis;Copeland;IEEE Trans. Compon. Packag. Manuf. Technol. Part A,1997
4. Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging;Fedorov;Int. J. Heat Mass Transfer,2000
5. Investigation of heat transfer in rectangular microchannels;Lee;Int. J. Heat Mass Transfer,2005
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