Thermal performance of pin fin heat sinks with phase change material for electronic devices thermal management-Reference-Cited by-同舟云学术

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Thermal performance of pin fin heat sinks with phase change material for electronic devices thermal management

Published:2024-08 Issue: Volume:250 Page:123456
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Li Jie,Duan Wenchao,Chen Yuehao,Chen Huilan,Song Mengjie^ORCID,Liao Shuguang,Shi Er,Sun Xiaoqin

Funder

National Natural Science Foundation of China

Changsha University of Science and Technology

Department of Science and Technology, Ministry of Science and Technology, India

Science and Technology Department of Ningxia Province

Chenzhou Municipal Science and Technology Bureau

Publisher

Elsevier BV

Reference45 articles.

1. Heat transfer enhancement of phase-change materials (PCMs) based thermal management systems for electronic components: A review of recent advances;Afaynou;Int. Commun. Heat Mass Transfer,2023

2. Embedded cooling method with configurability and replaceability for multi-chip electronic devices;Zhang;Energ. Conver. Manage.,2022

3. Research on passive cooling of electronic chips based on PCM: A review;Hua;J. Mol. Liq.,2021

4. Transient cooling of electronics using phase change material (PCM)-based heat sinks;Kandasamy;Appl. Therm. Eng.,2008

5. Thermal performance of heat spreader for electronics cooling with incorporated phase change material;Jaworski;Appl. Therm. Eng.,2012

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancements in Phase Change Materials: Stabilization Techniques and Applications;Prabha Materials Science Letters;2024-09-01

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