Embedded cooling method with configurability and replaceability for multi-chip electronic devices

Author:

Zhang Nan,Jiao Binbin,Ye Yuxin,Kong Yanmei,Du Xiangbin,Liu Ruiwen,Cong Bo,Yu Lihang,Jia Shiqi,Jia Kunpeng

Funder

Key Technologies Research and Development Program

Ministry of Science and Technology of the People's Republic of China

Publisher

Elsevier BV

Subject

Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment

Reference23 articles.

1. Gen 3 “Embedded” cooling: key enabler for energy efficient data centers;Bar-Cohen;IEEE Trans Comp Packaging Manuf Technol,2017

2. AMD EPYC 7H12 Review the Supercomputer EPYC, https://www.servethehome.com/amd-epyc-7h12-review-the-supercomputer-epyc/. [accessed 23 November 2021].

3. CNBC. Tesla unveils chip to train A.I. models inside its data centers, https://www.cnbc.com/2021/08/19/tesla-unveils-dojo-d1-chip-at-ai-day.html. [accessed 23 November 2021.

4. Comprehensive thermal resistance model of forced air cooling system for multiple power chips;Lin;Energy Rep,2021

5. Investigation on the temperature distribution in the two-phase spider netted microchannel network heat sink with non-uniform heat flux;Tan;Int J Therm Sci,2021

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