1. A. Bar-Cohen, J.J. Maurer, J.G. Felbinger, DARPA’s intra/interchip enhanced cooling (ICECool) program, In: CS MANTECH Conference, May 13th-16th, 2013.
2. Y.-F. Wu, M. Moore, A. Saxler, T. Wisleder, P. Parikh, 40-W/mm double field-plated GaN HEMTs, in: 2006 64th device research conference, IEEE, 2006, pp. 151-152.
3. Efficient microchannel cooling of multiple power devices with compact flow distribution for high power-density converters;Van Erp;IEEE Trans. Power Electron.,2020
4. Gen 3 “embedded” cooling: key enabler for energy efficient data centers;Bar-Cohen;IEEE Trans. Compon. Packag. Manuf. Technol.,2017
5. Near-junction cooling for next-generation power electronics;Zhou;Int. Commun. Heat Mass Transfer,2019