Enhanced Optical–Thermal Performances of High-Power LED by Plated Copper on Thick Film Ceramic Substrate-Reference-Cited by-同舟云学术

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Enhanced Optical–Thermal Performances of High-Power LED by Plated Copper on Thick Film Ceramic Substrate

Published:2023-07 Issue:7 Volume:70 Page:3774-3779
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Luo Tao¹^ORCID,Tong Yao¹,Lu Jicun²,Mou Yun¹,Wang Qing¹,Liu Jiaxin¹,Peng Yang³^ORCID,Chen Mingxiang¹^ORCID

Affiliation:

1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

2. Zhuhai Fudan Innovation Research Institute, Zhuhai, China

3. School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan, China

Funder

Application Innovation Program of Aerospace Science and Technology Group

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/10159202/10122573.pdf?arnumber=10122573

Reference35 articles.

1. Testing and Analysis of Boron-Doped Aluminum Nitride Thin-Film-Coated Al as Thermal Substrates in PCB Fabrication for LED Application

2. Research on dynamic thermal performance of high-power ThinGaN vertical light-emitting diodes with different submounts

3. Efficiency improvement of power LED modules using a hybrid aluminum nitride substrate

4. Investigation on Thermal Characterization of Eutectic Flip-Chip UV-LEDs With Different Bonding Voidage

5. Thermal design and analysis of multi-chip LED module with ceramic substrate

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review on thermal management of light-emitting diodes: From package-level to system-level;Applied Thermal Engineering;2024-12

2. Heat Dissipation Enhancement of High-Power Deep-Ultraviolet LEDs Through Plated Copper on Thick Film Diamond Substrates;IEEE Electron Device Letters;2024-09

3. High-reflectivity composite metal substrate for high-power IRLED;Results in Physics;2024-06

4. Packaged structure optimization for enhanced light extraction efficiency and reduced thermal resistance of ultraviolet B LEDs;Optics Express;2024-03-19

5. Wide heart-shaped mini-LEDs without a second lens as a large area, ultra-high luminance, and flat light source;Optics Express;2024-02-02

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