Temperature distribution in semiconductor wafers heated in a vertical diffusion furnace

Author:

Hirasawa S.,Kieda S.,Watanabe T.,Torii T.,Takagaki T.,Uchino T.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The Study of Slip Defects in Furnace High Temperature Process;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

2. Fast and Precise Temperature Control for a Semiconductor Vertical Furnace via Heater-Cooler Integration;IEEE Transactions on Semiconductor Manufacturing;2023-05

3. Heat transfer analysis on wafer annealing process in semiconductor multi-wafer furnace using CFD simulation;Journal of Mechanical Science and Technology;2022-05-28

4. Temperature Distribution and Deposition Rate on Semiconductor Wafers in Low-Pressure CVD Equipment Processing Two Wafers;IEEE Transactions on Semiconductor Manufacturing;2013-11

5. Factors Affecting Thickness Variation of ${\rm SiO}_{2}$ Thin Films Grown by Wet Oxidation;IEEE Transactions on Semiconductor Manufacturing;2011-05

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