Heat transfer analysis on wafer annealing process in semiconductor multi-wafer furnace using CFD simulation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://link.springer.com/content/pdf/10.1007/s12206-022-0545-4.pdf
Reference18 articles.
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3. S. Hirasawa et al., Temperature distribution in semiconductor wafers heated in a vertical diffusion furnace, IEEE Transactions on Semiconductor Manufacturing, 6(3) (1993) 226–232.
4. Y. H. Fan and T. Qiu, Analyses of thermal stresses and control schemes for fast temperature ramps of batch furnaces, IEEE Transactions on Semiconductor Manufacturing, 10(4) (1997) 433–437.
5. Y. H. Fan and T. Qiu, Transient heat transfer in batch thermal reactors for silicon wafer processing, International Journal of Heat and Mass Transfer, 41(11) (1998) 1549–1557.
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