Temperature Distribution and Stresses in Circular Wafers in a Row During Radiative Cooling
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1657208
Reference12 articles.
1. Thermal Conductivity of Pure and Impure Silicon, Silicon Carbide, and Diamond
2. Thermal Conductivity of Pure and Impure Silicon, Silicon Carbide, and Diamond
3. Emissivity at 0.65 Micron of Silicon and Germanium at High Temperatures
4. Thermal deflections of anisotropic thin plates
5. Macroscopic Plastic Properties of Dislocation‐Free Germanium and Other Semiconductor Crystals. I. Yield Behavior
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