A Revolution on the Horizon from DARPA: Heterogeneous Integration for Revolutionary Microwave\/Millimeter-Wave Circuits at DARPA: Progress and Future Directions-Reference-Cited by-同舟云学术

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A Revolution on the Horizon from DARPA: Heterogeneous Integration for Revolutionary Microwave\/Millimeter-Wave Circuits at DARPA: Progress and Future Directions

Published:2017-03 Issue:2 Volume:18 Page:44-59
ISSN:1527-3342
Container-title:IEEE Microwave Magazine
language:
Short-container-title:IEEE Microwave

Author:

Green Daniel S.,Dohrman Carl L.,Demmin Jeffrey,Zheng Yan,Chang Tsu-Hsi

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx7/6668/7843705/07843736.pdf?arnumber=7843736

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3. Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology;2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS);2023-10-25

4. From integrated circuits to integrated systems;SCIENTIA SINICA Informationis;2023-10-01

5. RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz;2023 53rd European Microwave Conference (EuMC);2023-09-19

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