Industrial and technical aspects of chip embedding technology
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4658784/4684310/04684368.pdf?arnumber=4684368
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Embedded-IC package using Si-interposer for mmWave Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
2. Die Attach Effect on Electrical Performance and Reliability of Embedded Die Package;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
3. Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages;Energies;2020-06-12
4. History of Embedded and Fan-Out Packaging Technology;Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies;2019-04-19
5. Evaluation of Residual Stress and Warpage of Device Embedded Substrates with Piezo-Resistive Sensor Silicon Chips;Transactions of The Japan Institute of Electronics Packaging;2015
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