History of Embedded and Fan-Out Packaging Technology

Author:

Töpper Michael1,Ostmann Andreas1,Braun Tanja1,Lang Klaus-Dieter1

Affiliation:

1. Fraunhofer IZM; Berlin Germany

Publisher

John Wiley & Sons, Inc.

Reference50 articles.

1. Active silicon chip carrier;Bodendorf;IBM Technical Disclosure Bulleting,1972

2. Johnson , R.W. Davidson , J.L. Jaeger , R. Kerns , D. 1986 Silicon hybrid wafer-scale package technology IEEE Journal of Solid State Circuits 845 851

3. Te Velde , T.S. Schmitz , A. 1968 Semiconductor circuit having active devices embedded in flexible sheet

4. Fillion , R.A. Wojnarowski , R.J. Daum , W. 1990 Bare chip test techniques for multichip modules Proceedings 40th Electronic Components and Technology Conference 554 558

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Panel‐Level Packaging for Heterogenous Integration;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03

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