Evaluation of Residual Stress and Warpage of Device Embedded Substrates with Piezo-Resistive Sensor Silicon Chips-Reference-Cited by-同舟云学术

Evaluation of Residual Stress and Warpage of Device Embedded Substrates with Piezo-Resistive Sensor Silicon Chips

Published:2015 Issue:1 Volume:8 Page:81-94
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Han Younggun¹,Horiuchi Osamu¹,Hayashi Shigehiro²,Nogita Kanta²,Katoh Yoshihisa¹,Nanami Kyosuke³,Tomokage Hajime¹²³

Affiliation:

1. Center of System Integration Platform Organization Standards, Fukuoka University

2. Research Center for Three Dimensional Semiconductors

3. Department of Electronics Engineering & Computer Science, Fukuoka University

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_81/_pdf

Reference21 articles.

1. [1] A. Ostmann, D. Manessis, J. Stahr, M. Beesley, M. Cauwe, and J. D. Baets, "Industrial and Technical Aspects of Chip Embedding Technology," 2^nd Electronics System-integration Technology Conference (ESTC), Greenwich, UK, Sept. 2008, pp. 315-320.

2. [2] G. J. Vandentop, S. N. Towle, H. Braunisch, C. Hu, and R. D. Emery, "Bumpless Build-Up Packaging," ASME International Mechanical Engineering Congress and Exposition, Nov. 2001.

3. [3] H. Braunisch, S. N. Towle, R. D. Emery, C. Hu, and G. J. Vandentop, "Electrical Performance of Bumpless Build-Up Layer Packaging," 52^nd Electronic Components and Technology Conference (ECTC), May. 2002, pp. 353-358.

4. [4] T. Waris, R. Touminen, J. Kivilahti, "Panel-sized integrated module board manufacturing," Proc. Polytronics Conference, Potszam, Germany, Oct. 2001, pp. 218-223.

5. [5] A. Ostamann, A. Neumann, P. Sommer, H. Reichl, "Buried components in printed circuit boards," Advancing Microelectronics, May/Jun. 2005, pp. 13-18.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fine Copper Lines with High Adhesion on High Rigidity Dielectrics;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Maleimide Resin Blends with Enhanced Toughness for High-Temperature Semiconductor Packaging;Transactions of The Japan Institute of Electronics Packaging;2021

3. Effects of External Bending Stress on Characteristic Change of Embedded Device;Transactions of The Japan Institute of Electronics Packaging;2017