Nano anchoring copper foil for next generation printed wiring boards
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7422513/7428382/7428430.pdf?arnumber=7428430
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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3. Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics;2022 IEEE CPMT Symposium Japan (ICSJ);2022-11-09
4. Fine Copper Lines with High Adhesion on High Rigidity Dielectrics;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate;Transactions of The Japan Institute of Electronics Packaging;2018
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