Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics

Author:

Yagisawa Takatoshi1,Miyoshi Makoto1,Miike Jumpei1,Azuma Tomonori1,Harada Yoshiyuki1,Ide Satoshi1,Morito Ken1

Affiliation:

1. Fujitsu Optical Components Limited,Nakahara-ku,Kawasaki,Japan,211-8588

Publisher

IEEE

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A 16-Channel Optical Receiver Circuit for a Multicore Fiber-Based Co-Packaged Optics Module in a 65-nm CMOS Chip;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-05

2. A 4×32-Gb/s VCSEL Driver with Adaptive Feedforward Equalization in 65-nm CMOS;2023 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS);2023-12-04

3. Temperature Distribution Measurement System for a Water-Cooled CPO Daughter Board;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15

4. 4-ch 25-Gb/s Small and Low-power VCSEL Driver Circuit with Unbalanced CML in 65-nm CMOS;2023 20th International SoC Design Conference (ISOCC);2023-10-25

5. High-Speed, Low-Power, and Small-Area Optical Receiver in 65-nm CMOS;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

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