Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate-Reference-Cited by-同舟云学术

Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate

Published:2018 Issue:0 Volume:11 Page:E17-016-1-E17-016-6
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Akahoshi Tomoyuki¹,Mizutani Daisuke¹,Sugimoto Kaoru²,Kouzai Hiroaki³,Watanabe Mitsuhiro³

Affiliation:

1. Fujitsu Laboratories Ltd.

2. Fujitsu Interconnect Technologies Ltd.

3. Kanto Gakuin University

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/11/0/11_E17-016-1/_pdf

Reference8 articles.

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4. [4] G. Shiue, C. Yeh, L. Liu, H. Wei, and W. Ku, "Influence and Mitigation of Longest Differential via Stubs on Transmission Waveform and Eye Diagram in a Thick Multilayered PCB," IEEE Trans. CPMT, Vol. 4, No. 10, pp. 1657–1670, Oct. 2014.

5. [5] J. Zhang, Q. B. Chen, H. Wang, J. Fan, A. Orlandi, and J. L. Drewniak, "Stub Length Prediction for Back-Drilled Vias Using a Fast Via Tool," IEEE Electrical Design of Advanced Packaging and Systems 2010.