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Influence and Mitigation of Longest Differential via Stubs on Transmission Waveform and Eye Diagram in a Thick Multilayered PCB

  • Published:2014-10 Issue:10 Volume:4 Page:1657-1670
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Shiue Guang-Hwa,Yeh Chi-Lou,Liu Li-Sang,Wei Hao,Ku Wei-Cheng

Funder

National Science Council

College of Electrical Engineering and Computer Science, Chung Yuan Christian University, Taoyuan, Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards;Electronics;2024-08-26

2. Signal integrity aspect of High Speed Interface Routing in multilayered PCB environment;2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON);2023-12-11

3. Signal Integrity Measurement Issue Debugging for HDMI2.1 CRLS Topology: A Case Study;2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON);2023-12-11

4. On-Dual In-line Memory Module (DIMM) Low-Pass Filter (LPF) using Via Stubs for Enhancing Signal Integrity;2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2022-10-09

5. Symmetric-Cell EBG Theory and Its Applications to Vias Daisy Chain for Residual Stub Detection;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
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