Effect of Ni(P) thickness of ultrathin ENEPIG on the interfacial reaction and board level reliability of solder joints
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159511.pdf?arnumber=9159511
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Board-level Reliability Performance Comparison of Thin and Thick Ni plating ENEPIG Laminate LGA and BGA Packages;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Investigation of Reflow Effect and Empirical Lifetime Modeling on the Board Level Solder Joint Reliability;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. A Parameter Study for the Design Optimization to Relieve Pattern Stress of PCB under the Temperature Cycling Condition;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. Study of Long-term Solder Joint and Board-level Reliability Performance of Thin Nickel Plating ENEPIG Laminate LGA Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth;Recent Progress in Lead-Free Solder Technology;2022
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