A Parameter Study for the Design Optimization to Relieve Pattern Stress of PCB under the Temperature Cycling Condition-Reference-Cited by-同舟云学术

A Parameter Study for the Design Optimization to Relieve Pattern Stress of PCB under the Temperature Cycling Condition

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Noh Hyunggyun¹,Lee Kyungwoo¹,Bae Jinsu¹,Hwang Yuchul¹,Kim Hoosung¹,Pae Sangwoo¹

Affiliation:

1. Samsung Electronics Memory Business,Product Quality Assurance Team,Hwaseong,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816410.pdf?arnumber=9816410

Reference9 articles.

1. WLCSP Solder Ball Interconnection Enhancement for High Temperature Stress Reliability

2. A Study of the Board Level Reliability of Large 16FF Wafer Level Package for RF Transceivers

3. Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)

4. The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard;yu;Proc Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM) Packaging and Manufacturing Technology Society (CPMT) IEEE Components,2006

5. Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints;koo;J Microelectron Packag Soc,2007

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