Study of Long-term Solder Joint and Board-level Reliability Performance of Thin Nickel Plating ENEPIG Laminate LGA Package-Reference-Cited by-同舟云学术

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Study of Long-term Solder Joint and Board-level Reliability Performance of Thin Nickel Plating ENEPIG Laminate LGA Package

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Tchun Seok-Phyo¹,Kim Joo-Yeop¹,Raj Arun²

Affiliation:

1. Analog Devices, Inc.,Assembly Technology Development,Seoul,Korea

2. Package Development Analog Devices, Inc.,Wilmington,MA,USA

Funder

Analog Devices

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816705.pdf?arnumber=9816705

Reference9 articles.

1. Investigation of IMC growth and solder joint reliability on new surface finish-ENEPIG

2. Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG pad after multiple reflows

3. Brittle fracture behavior and interfacial reaction of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish

4. Effect of interfacial reaction layer on the brittle fracture of the SAC305 solder joint on ENIG and ENEPIG surface finish

5. Wire bonding performance and solder joint reliability investigation on ENEPIG finish substrate

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1. Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits;Materials;2023-10-17

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