Ultra High Density SoIC with Sub-micron Bond Pitch-Reference-Cited by-同舟云学术

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Ultra High Density SoIC with Sub-micron Bond Pitch

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Chen Y. H.,Yang C. A.,Kuo C. C.,Chen M. F.,Tung C. H.,Chiou W. C.,Yu Douglas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159481.pdf?arnumber=9159481

Cited by 46 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. 3D IC Architecture Evaluation and Optimization with Digital Compute-in-Memory Designs;Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design;2024-08-05

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