3D IC Architecture Evaluation and Optimization with Digital Compute-in-Memory Designs-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

3D IC Architecture Evaluation and Optimization with Digital Compute-in-Memory Designs

Published:2024-08-05 Issue: Volume:55 Page:1-6
ISSN:
Container-title:Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design
language:
Short-container-title:

Author:

Byun Hyung Joon¹^ORCID,Gupta Udit¹^ORCID,Seo Jae-sun¹^ORCID

Affiliation:

1. Cornell Tech, New York, NY, United States

Funder

SRC/DARPA

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3665314.3670838

Reference17 articles.

1. Rongmei Chen et al. 2020. 3D-Optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes. In IEEE IEDM.

2. Y. H. Chen et al. 2020. Ultra High Density SoIC with Sub-micron Bond Pitch. In IEEE ECTC.

3. Hidehiro Fujiwara et al. 2022. A 5-nm 254-TOPS/W 221-TOPS/mm2 Fully-Digital Computing-in-Memory Macro Supporting Wide-Range Dynamic-Voltage-Frequency Scaling and Simultaneous MAC and Write Operations. In IEEE ISSCC.

4. A 7.5 Gb/s/pin 8-Gb LPDDR5 SDRAM with Various High-Speed and Low-Power Techniques;Kyung-Soo Ha;IEEE Journal of Solid-State Circuits (JSSC),2019

5. Jun-Woo Jang et al. 2021. Sparsity-Aware and Re-configurable NPU Architecture for Samsung Flagship Mobile SoC. In ACM/IEEE ISCA.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP