Modeling and Analysis of Cu-Carbon Nanotube Composites for Sub-Threshold Interconnects
Author:
Affiliation:
1. Electronics and Communication Engineering Department, National Institute of Technology, Hamirpur, HP, India
2. Electronics and Communication Engineering Department, Indian Institute of Technology Roorkee, Roorkee, UK, India
Funder
Science and Engineering Research Board
Department of Science and Technology
Government of India, New Delhi
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Materials Chemistry,Electrical and Electronic Engineering,Computer Science Applications,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/8782713/9680797/09944876.pdf?arnumber=9944876
Reference27 articles.
1. Fabrication of carbon nanotube/copper and carbon nanofiber/copper composites for microelectronics
2. One hundred fold increase in current carrying capacity in a carbon nanotube–copper composite
3. Proposal and Analysis of Mixed CNT Bundle for Sub-Threshold Interconnects
4. Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
5. Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Pragmatic structure optimization: Achieving optimal crosstalk delay and gate oxide reliability of randomly mixed CNT bundle interconnects;Micro and Nanostructures;2024-11
2. Modeling and analysis of crosstalk induced effects in graphene-carbon nanotube composite interconnects;Micro and Nanostructures;2024-10
3. Crosstalk and Power Analysis in Tapered based Composite Cu-CNT TSV in 3D IC;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19
4. An Extensive Review on Bibliometric Analysis of Carbon Nanostructure Reinforced Composites;2024
5. Electrical modeling and transmission performance analysis of carbon nanotube-graphene mixed structure interconnects;Microelectronics Journal;2023-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3