Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics-Reference-Cited by-同舟云学术

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Published:2014 Issue:5 Volume:6 Page:2669-2674
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Subramaniam Chandramouli¹²³,Yasuda Yuzuri¹²³,Takeya Satoshi⁴⁵²³,Ata Seisuke¹²³⁶⁵,Nishizawa Ayumi¹²³,Futaba Don¹²³⁶⁵,Yamada Takeo¹²³⁶⁵,Hata Kenji¹²³⁶⁵

Affiliation:

1. Technology Research Association for Single wall Carbon Nanotubes (TASC)

2. Tsukuba 305-8565

3. Japan

4. Research Institute of Instrumentation Frontier (RIIF)

5. National Institute of Advanced Industrial Science and Technology (AIST)

6. Nanotube Research Center

Abstract

A composite that synergistically combines the best thermal properties of carbon nanotubes and copper is developed for efficient cooling of microelectronics.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2014/NR/C3NR05290G

Reference25 articles.

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3. Thermal conductance through molecular wires

4. End of Moore's law: thermal (noise) death of integration in micro and nano electronics

5. Thermal Runaway in Integrated Circuits

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