Distributed Thermal Modeling for Power Devices and Modules With Equivalent Heat Flow Path Extraction-Reference-Cited by-同舟云学术

Distributed Thermal Modeling for Power Devices and Modules With Equivalent Heat Flow Path Extraction

Published:2023-12 Issue:6 Volume:11 Page:5863-5876
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Yang Xin¹^ORCID,Xu Siwei²^ORCID,Heng Ke³^ORCID,Wu Xinlong²^ORCID

Affiliation:

1. College of Electrical and Information Engineering, Engineering Research Center of Advanced Semiconductor Technology and Application of Ministry of Education, National Key Laboratory of Power Semiconductor and Integration Technology, and the Changsha Semiconductor Technology and Application Innovation Research Institute, Hunan University, Changsha, China

2. College of Electrical and Information Engineering, Hunan University, Changsha, China

3. Xuzhou Power Supply Company of State Grid Jiangsu Electric Power Company, Ltd., Xuzhou, China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hunan Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://xplorestaging.ieee.org/ielx7/6245517/10336248/10268446.pdf?arnumber=10268446

Reference36 articles.

1. Frequency-Domain Thermal Coupling Model of Multi-Chip Power Module

2. A Partition Decoupling Algorithm for Compact Thermal Model in Multichip IGBT Modules

3. A 3-D thermal network model for the temperature monitoring of thermal grease as interface material

4. Physics-based thermal impedance model for power module by analytic Fourier series based heat spreading angle;chen;Proc CSEE,2022

5. Comparison of High Voltage SiC MOSFET and Si IGBT Power Module Thermal Performance

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Power Semiconductor Junction Temperature and Lifetime Estimations: A Review;Energies;2024-09-12

2. Sensitivity analysis and reasonable matching of key operating parameters of flow and heat transfer in liquid-cooling plate used for IGBT module of high-speed train traction inverters;Case Studies in Thermal Engineering;2024-09

3. Investigation on the thermal characteristics of electronic system and prediction of chip temperature by machine learning;Nuclear Engineering and Technology;2024-08

4. A Compact Inductively Coupled SiC MOSFET Snubber for Quasi-Zero-Voltage Turn-On, Switching Oscillation, and Voltage Spike Suppression;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-06

5. A Decoupled Junction Temperature and Aging Level Evaluating Method for SiC MOSFETs;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-06