A Partition Decoupling Algorithm for Compact Thermal Model in Multichip IGBT Modules-Reference-Cited by-同舟云学术

A Partition Decoupling Algorithm for Compact Thermal Model in Multichip IGBT Modules

Author:

Guo Weisheng¹^ORCID,Ma Mingyao¹^ORCID,Wang Hai²^ORCID,Wang Hanyu¹^ORCID,Song Qiwei¹,Chen Wenjie³

Affiliation:

1. National Laboratory for Renewable Energy Access to Grid, Hefei University of Technology, Hefei, China

2. Discipline of Engineering and Energy College of Science, Health, Engineering Education, Murdoch University, Murdoch, WA, Australia

3. Sungrow Power Supply Co., Ltd., Hefei, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

Reference11 articles.

3. Dimensioning program IPOSIM for loss and thermal calculation of Infineon IGBT modules;notes,0

4. A thermal estimation method for IGBT module adaptable to operating conditions;guo;IEEE Trans Power Electron,2020

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