A 3-D thermal network model for the temperature monitoring of thermal grease as interface material

Author:

Zhang Xiaotong,Wang Shihang,Xin Lei,Wu Kangning,Yu Xiaoling,Wang Xiaolin,Li Jianying

Funder

National Key Research and Development Program of China

State Key Laboratory of Electrical Insulation and Power Equipment

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Thermal interface materials for power electronics applications;Narumanchi,2008

2. Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology;Cheng;IEEE Trans. Compon. Packag. Technol.,2006

3. An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications;Chiu,2001

4. A thermal model for insulated gate bipolar transistor module;Luo;IEEE Trans. Power Electron.,2004

5. A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules;Bahman;IEEE Trans. Power Electron.,2017

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