A 3-D Thermal Network Model for IGBT Modules Considering Temperature Dependence of Heat Dissipation and Thermal Coupling-Reference-Cited by-同舟云学术

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A 3-D Thermal Network Model for IGBT Modules Considering Temperature Dependence of Heat Dissipation and Thermal Coupling

Published:2024-05-17 Issue: Volume: Page:4906-4910
ISSN:
Container-title:2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
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Author:

Zhang Xiaotong¹,Tong Xiangqian¹,Lv Chunlin²,Du Shengwei³,Chen Kai⁴,Wu Kangning²,Li Jianying²

Affiliation:

1. Xi'an University of Technology,School of Electrical Engineering,China

2. Xi’an Jiaotong University,State Key Laboratory of Electrical Insulation and Power Equipment,China

3. State Grid Zhejiang Electric Power Co., LTD.,Jinhua Power Supply Company,China

4. State Grid Zhejiang Electric Power Co., LTD.,Hangzhou Power Supply Company,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10567049/10567050/10567897.pdf?arnumber=10567897

Reference14 articles.

1. A thermal network model for monitoring IGBT chip solder degradation based on feedback PI control

2. A High-Resolution Analytical Thermal Modeling Method of Capacitor Bank Considering Thermal Coupling and Different Cooling Modes

3. Effects of Electrothermal Aging on Surface Morphology and Dielectric Properties of Poly(Ethylene Terephthalate) in Laminated Busbars

4. Backstepping based nonlinear control strategy for MMC topology

5. Simplified direct modulation prediction approach for modular multilevel converter

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