An 8b-Precision 8-Mb STT-MRAM Near-Memory-Compute Macro Using Weight-Feature and Input-Sparsity Aware Schemes for Energy-Efficient Edge AI Devices
Author:
Affiliation:
1. Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
2. Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan
Funder
Taiwan Semiconductor Manufacturing Company (TSMC)-Joint Developed Project
National Science and Technology Council (NSTC) of Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/4/10375801/10292992.pdf?arnumber=10292992
Reference40 articles.
1. Challenges and Trends of SRAM-Based Computing-In-Memory for AI Edge Devices
2. Challenges and Trends of Nonvolatile In-Memory-Computation Circuits for AI Edge Devices
3. A 5-nm 254-TOPS/W 221-TOPS/mm2 Fully-Digital Computing-in-Memory Macro Supporting Wide-Range Dynamic-Voltage-Frequency Scaling and Simultaneous MAC and Write Operations
4. A 1.041-Mb/mm2 27.38-TOPS/W Signed-INT8 Dynamic-Logic-Based ADC-less SRAM Compute-in-Memory Macro in 28nm with Reconfigurable Bitwise Operation for AI and Embedded Applications
5. 16.4 An 89TOPS/W and 16.3TOPS/mm2 All-Digital SRAM-Based Full-Precision Compute-In Memory Macro in 22nm for Machine-Learning Edge Applications
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. An 8b-Precison 16-Kb FDSOI 8T SRAM CIM macro based on time-domain for energy-efficient edge AI devices;Microelectronics Journal;2024-09
2. STT-MRAM-based Near-Memory Computing Architecture with Read Scheme and Dataflow Co-Design for High-Throughput and Energy-Efficiency;Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design;2024-08-05
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