Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company, Ltd.,Advanced Packaging Technology and Service,Hsinchu,R.O.C.,300-77
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457869.pdf?arnumber=10457869
Reference6 articles.
1. Reliability evaluation of a CoWoS-enabled 3D IC package
2. Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages
3. Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)
4. Multilayer RDL Interposer for Heterogeneous Device and Module Integration
5. Comprehensive PDN/PSIJ analysis of silicon capacitor use for 8.533 GT/s LPDDR5X application
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1. An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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