Reliability evaluation of a CoWoS-enabled 3D IC package-Reference-Cited by-同舟云学术

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Reliability evaluation of a CoWoS-enabled 3D IC package

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Banijamali Bahareh,Chiu Chien-Chia,Hsieh Cheng-Chieh,Lin Tsung-Shu,Hu Clark,Hou Shang-Yun,Ramalingam Suresh,Jeng Shin-Puu,Madden Liam,Yu Doug. C. H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575547.pdf?arnumber=6575547

Cited by 45 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Challenges: ESD Protection for Heterogeneously Integrated SoICs in Advanced Packaging;Electronics;2024-06-15

2. Advances and Reliability Challenges in Heterogeneous Integration in Chiplet ERA: From Solder to Copper to Optical Interconnects;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

3. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

4. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

5. Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

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