Assembly process characterization of 3D Stacking of Heterogeneous Chiplets
Author:
Affiliation:
1. A*STAR (Agency for Science, Technology and Research),Institute of Microelectronics,Singapore
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457705.pdf?arnumber=10457705
Reference9 articles.
1. Advanced RF Packaging Technology Trends, from WLP and 3D Integration to 5G and Mmwave Applications
2. 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer
3. Chiplet-based System PSI Optimization for 2.5D/3D Advanced Packaging Implementation
4. Die Embedding Challenges for EMIB Advanced Packaging Technology
5. Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications
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