Advanced RF Packaging Technology Trends, from WLP and 3D Integration to 5G and Mmwave Applications
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8902179/8913841/08914089.pdf?arnumber=8914089
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Assembly process characterization of 3D Stacking of Heterogeneous Chiplets;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications;Journal of Manufacturing and Materials Processing;2023-08-03
3. A Review of Hybrid Supply Modulators in CMOS Technologies for Envelope Tracking PAs;IEEE Transactions on Power Electronics;2023-05
4. Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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